Fluorocarbons Gases

หมวดหมู่: Fluorocarbons and Rare Gasesc

-Halocarbon 116 (Hexafluoroethane)(C2F6)

Halocarbon 116 (Hexafluoroethane)(C2F6) is a colorless, nontoxic, noncorrosive, nonflammable gas which is extremely stable. When heated to decomposition, toxic byproducts are formed. Contact with liquid may cause frostbite. Shipped as a liquefied gas under its own vapor pressure (415 psig @ 70 °F)

-Halocarbon 1216 (Hexafluoropropylene) C3F6

C3F6, Hexafluoropropene; Perfluoro-1-propene; Perfluoropropene; Perfluoropropylene; freon R 1216; halocarbon R 1216; fluorocarbon 1216

-Halocarbon 14 (Tetrafluoromethane) (CF4)

Description

Halocarbon 14 (Tetrafluoromethane) (CF4) is a colorless, nontoxic, nonflammable, noncorrosive gas with a slight ether-like odor. Halocarbon 14 is normally compressed and shipped at high pressure.

Applications

Halocarbon 14 is combined with Oxygen to etch Polysilicon, Silicon Dioxide, Silicon Nitrite, some Metals and Metal Silicides. It can be combined with Halocarbon 116 or used alone to clean wafers and chambers

-Halocarbon 218 (Perfluoropropane)(C3F8)

Description

Halocarbon 218 (Perfluoropropane)(C3F8) is a colorless, nonflammable, nontoxic gas which is relatively stable and has a faintly sweet odor. Halocarbon 218 is shipped as a liquefied gas under its own vapor pressure (100 psig @ 70° F).

Applications

Halocarbon 218 is used for plasma etching. The chemical composition of Halocarbon 218 supplies a higher ratio of Fluorine to Carbon than any of the other Halocarbon gases supplied by Electronic Fluorocarbons LLC. When Halocarbon 218 is exposed to the RF field generated in the etch process, a gas plasma is produced that will etch Silicon Dioxide or Silicon Nitrite with exellent selectivity

-Halocarbon 23 (Trifluoromethane)(CHF3)

Description

Halocarbon 23 (Trifluoromethane)(CHF3) is a colorless, nontoxic, nonflammable gas with a slightly ethereal odor. Contact with liquid may cause frostbite. Shipped as a liquefied gas under its own vapor pressure (635 psig @ 70°F).

Applications

Halocarbon 23 is often used in combination with Halocarbon 14 and Halocarbon 116 to improve etch rate, selectivity and uniformity in etching

-Halocarbon 32 (Difluoromethane)(CH2F2)

Description

Halocarbon 32 (Difluoromethane)(CH2F2) is a colorless, flammable gas with a slight ether-like odor. Halocarbon 32 is shipped as a liquefied gas under its own vapor pressure

(207 psig @ 70°F).

Applications

Halocarbon 32 is used for plasma etching and disassociates into reactive fluoride ions in the presence of an RF field

-Halocarbon c-318 (octafluorocyclobutane)(C4F8)

Description

Halocarbon c-318 (octafluorocyclobutane)(C4F8) is a colorless, nonflammable, nontoxic, odorless gas. Halocarbon c-318 is shipped as a liquefied gas under its own vapor pressure (25 psig @ 70 °F).

Applications

Halocarbon 318 is used for plasma etching. When Halocarbon 318 is exposed to the RF field generated in the etch process, a gas plasma is produced that will etch silicon compounds with excellent selectivity.

-Sulfur Hexafluoride SF6

Description

A colorless, odorless, non-toxic, liquified gas. Shipped as a liquid under its own vapor pressure.

Applications

Sulfur Hexafluoride is used for plasma etching prior to chemical vapor deposition (VCD). These processes include Oxide etching, Nitride etching and wafer cleaning. Sulfur Hexafluoride gas, which is itself inert, disassociates in the presence of an RF field to form reactive fluorine ions. These highly reactive ions are excellent for etching tungsten and tungsten silicide films.

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